Via Challenge

To get the true picture of the via plating thickness, it is essential that the cross-section is made in the exact center of the via. It is preferred to cross-section multiple vias simultaneously. This is where manual preparation becomes difficult even for the skilled person.


A short and reproducible five-step preparation method taking only 17 minutes results in ready-to-inspect cross sections. The material removal is controlled throughout the preparation, resulting in samples exposing the exact centers of the 100 and 200 µm vias. Automated coupon extraction and preparation eliminate the risk of passing the target and contribute to high reproducibility.

Tell us who you are, and you may download a materialographic solution report of one of our many solution methods. Please don’t hesitate to contact us if you have a specific problem that you would like us to help you with.